The 12-core AMD Ryzen 9 7900X3D desktop CPU debuted in 2023. This processor utilizes the Zen 4 (Raphael) architecture and the AM5 socket, making it a member of the Ryzen 9 family. The number of available cores has been essentially boosted from 12 to 24 by using AMD’s Simultaneous Multithreading (SMT) technology. The base clock speed of Ryzen 9 7900X3D is 4.4 GHz, with a possible increase to 5.6 GHz when more work has to be done in less time. It features 128 MB of L3 cache. The Ryzen 9 7900X3D from AMD is fabricated utilizing a 5 nm fabrication technology and 13,140,000,000 transistors. Rather of being made in an AMD factory, the chip’s silicon die is produced at a TSMC foundry. Overclocking on Ryzen 9 7900X3D is substantially facilitated by the fact that the multiplier can be unlocked and adjusted at will. This makes it possible to set the desired overclocking frequency with relative ease.
The Ryzen 9 7900X3D has a thermal design power (TDP) of 120 W, therefore it requires effective cooling to function properly. The dual-channel interface of DDR5 memory is supported by AMD’s CPU. Officially, 5200 MHz is the maximum memory speed that can be used, but with little tweaking (and the correct memory modules), you may get even higher speeds. It also supports error-correcting code memory, an essential feature for mission-critical systems that must safeguard their data against corruption. The PCI-Express Gen 5 interface is used by
Ryzen 9 7900X3D to talk to the rest of the computer. The Radeon Graphics engine is incorporated into this CPU.
The Ryzen 9 7900X3D has hardware virtualization capabilities, which significantly boosts the efficiency of virtual machines. Applications that take use of the processor’s ability to run programs that use Advanced Vector Extensions (AVX) will run quickly. In addition to AVX, AMD is also implementing the more recent AVX2, but not the more advanced AVX-512, standard.
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AMD Ryzen 9 7900X3D Specifications
AMD reveals there are 7000X3D cpu’s. In the below table, you will know Ryzen 9 7900X3D Specifications.
Physical
| Socket: | AMD Socket AM5 |
|---|---|
| Foundry: | TSMC |
| Process Size: | 5 nm |
| Transistors: | 13,140 million |
| Die Size: | 2x 71 mm² |
| I/O Process Size: | 6 nm |
| I/O Die Size: | 122 mm² |
| Package: | FC-LGA1718 |
| tCaseMax: | 47°C |
| tJMax: | 89°C |
Performance
| Frequency: | 4.4 GHz |
|---|---|
| Turbo Clock: | up to 5.6 GHz |
| Base Clock: | 100 MHz |
| Multiplier: | 44.0x |
| Multiplier Unlocked: | Yes |
| TDP: | 120 W |
| PPT: | 230 W |
Cores
| # of Cores: | 12 |
|---|---|
| # of Threads: | 24 |
| SMP # CPUs: | 1 |
| Integrated Graphics: | Radeon Graphics |
Cache
| Cache L1: | 64K (per core) |
|---|---|
| Cache L2: | 1MB (per core) |
| Cache L3: | 128MB (shared) |
| 3D V-Cache: | 1x 64MB Slice |
Architecture
| Market: | Desktop |
|---|---|
| Production Status: | Active |
| Release Date: | Jan 4th, 2023 |
| Retail Availability: | Feb 2023 |
| Codename: | Raphael |
| Generation: | Ryzen 9 (Zen 4 (Raphael)) |
| Part#: | 100-000000909 |
| Memory Support: | DDR5-5200 MHz Dual-channel |
| ECC Memory: | Yes |
| PCI-Express: | Gen 5, 24 Lanes (CPU only) |
| Chipsets: | X670E, X670, B650E, B650 |
Features
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Source: techpowerup
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