AMD Ryzen 9 7950X3D Specifications

Introduced in January 2023, the AMD Ryzen 9 7950X3D is a 16-core desktop CPU. This processor utilizes the Zen 4 (Raphael) architecture and the AM5 socket, making it a member of the Ryzen 9 family. With AMD’s SMT technology, the number of cores is virtually increased to 32. The base frequency of Ryzen 9 7950X3D is 4.2 GHz, and it can reach a maximum of 5.7 GHz when under stress, with 128 MB of L3 cache. With a 5 nm production node and 13,140 million transistors, AMD manufactures the Ryzen 9 7950X3D. The chip’s silicon die is made at TSMC’s foundry rather than AMD’s. The unlocked multiplier on Ryzen 9 7950X3D makes it much easier to overclock, letting you choose your desired frequency with relative ease.

The Ryzen 9 7950X3D has a thermal design power (TDP) of 120 W, therefore it requires effective cooling to function properly. The AMD CPU may use two channels of DDR5 memory. Memory speeds higher than 5200 MHz are possible with overclocking (and the correct memory modules). Support for error-correcting code (ECC) memory is also included, which is crucial for mission-critical systems. Ryzen 9 7950X3D employs a PCI-Express Gen 5 interface to talk to other parts of the PC. The Radeon Graphics engine is built right into this chip.

Ryzen 9 7950X3D supports hardware virtualization, which significantly boosts the performance of virtual machines. By supporting AVX instructions, this CPU is better suited for programs that conduct extensive calculations. In addition to AVX, AMD now also supports the newer AVX2 and AVX-512 instructions.

AMD Ryzen 9 7950X3D

AMD’s Ryzen 9 7950X3D is one of the company’s desktop processors. There are 16 processor “cores” and 32 “threads” within. The CPU runs at 4200 MHz at base, but can reach 5300 MHz with Turbo Boost enabled. You may expect speeds of up to 5700 MHz from it. The AMD Ryzen 9 7950X3D includes AMD Radeon graphics processing.

AMD Ryzen 9 7950X3D Specs. Using a 5 nm construction technology, the TDP of the 120W AMD Ryzen 9 7950X3D is quite low. The memory interface is a double-channel design, and the memory speed is 5200 MT/s for DDR5 modules.


Socket:AMD Socket AM5
Process Size:5 nm
Transistors:13,140 million
Die Size:2x 71 mm²
I/O Process Size:6 nm
I/O Die Size:122 mm²


# of Cores:16
# of Threads:32
SMP # CPUs:1
Integrated Graphics:Radeon Graphics


Frequency:4.2 GHz
Turbo Clock:up to 5.7 GHz
Base Clock:100 MHz
Multiplier Unlocked:Yes
TDP:120 W
PPT:230 W


Production Status:Active
Release Date:Jan 4th, 2023
Retail Availability:Feb 2023
Generation:Ryzen 9
(Zen 4 (Raphael))
Memory Support:DDR5-5200 MHz
ECC Memory:Yes
PCI-Express:Gen 5, 24 Lanes
(CPU only)
Chipsets:X670E, X670, B650E, B650


  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • SMT
  • Precision Boost 2
  • XFR 2

Source: techpowerup

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